TDK-Invensense acquired Chirp in 2018. Chirp's MEMS-based ultrasonic technology uses time-of-flight (ToF) ranging sensors and energy-efficient digital signal processor (DSP) ASICs in a 3.5 mm x 3.5 mm package. The sensor provides customers with flexible industrial design options suitable for a wide range of use case scenarios, including ranging, presence and proximity sensing, object detection and avoidance, and location tracking.

As the target of CH-101 can be 1.2m farthest, it can provide accurate distance measurement, and the farthest of CH-201 can be 5m. Through ultrasonic measurement, the sensor can work under any lighting conditions, from full daylight to complete darkness, and provide millimeter-level precision range measurement, regardless of the target color and optical transparency. The wide field of view (FoV) of the sensor can be customized and can measure multiple objects in the FoV at the same time.